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Posted 11 months ago

Advanced Packaging Design Engineer

@ AttoTude

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Ottawa, Ontario

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SIGNALS

Overview

AttoTude is hiring an Advanced Packaging Design Engineer in Ottawa, ON, for a full-time, on-site role. The work covers advanced packaging architecture, detailed design, validation and new product introduction, with cross-functional and supplier collaboration.

Responsibilities:

  • Design advanced packaging solutions
  • Conduct research and development initiatives
  • Collaborate with cross-functional teams and suppliers
  • Manage deliverables for timely delivery
  • Own architecture through new product introduction

Requirements summary:

  • Experience in advanced silicon packaging and multichip module design
  • Mechanical, thermal and FEA modeling experience
  • Proven product development from concept to volume production
  • Ability to drive cross-disciplinary technical collaboration
  • Master's degree or higher in Mechanical Engineering, Materials Science or related field

Tools & skills

Packaging processesPackagingResearchProblem solvingAssemblyFEAMechanical engineeringMaterials science
Source and dates

Employer career site / ATS feed · greenhouse

Employer posting date
2025-12-17
First seen by our source
2026-10-08
Source record updated
2026-10-10

These dates describe the source record, not a live verification that the employer is still hiring. Check the original posting.

Job details

DepartmentEngineering
Hours per week40 (estimated)
Work settingOffice, Laboratory
PositionMostly sitting
Physical demandsphysical low · computer high
LanguagesEnglish
EducationMaster’s degree (required)
Fields of studyMechanical Engineering, Materials Science

Summary and details written by AI from the posting; the employer’s posting is the authority.

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AttoTude

Saved company profile

Historical company information from a saved The Jobs API profile (LinkedIn/Crunchbase fields). It is not live-verified; figures may have changed. Missing values remain unknown.

A leap forward in networking.

Full company description

The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI. AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing applications.

LinkedIn followers
1,058
People associated on LinkedIn
41
Reported office locations
  • Menlo Park, CA 94025, US
  • Ottawa, Ontario, CA
  • San Diego, CA, US
  • Dallas, TX, US
Business categories
  • Information Technology
  • Internet
  • Artificial Intelligence (AI)
  • Wireless
Other recorded names
  • AttoTude
Profile identifies a recruitment agency
No
Reported total investment
142,000,000

Currency and observation date were not supplied; this is not a current valuation or a funding round.

View all jobs Website

The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI. AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing…

FieldValue
IndustryTechnology, Information and Internet
Company size11-50 employees
HeadquartersMenlo Park, CA
Organization typePrivately Held
Year founded2024
Open jobs on Jobsy1
LinkedInView page
Job description

Role Description

This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.

Qualifications

  • Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.

    Mechanical, thermal and FEA modeling and design experience.

  • Proven track-record of product development, from concept through volume production.

  • Ability to work effectively in cross-disciplinary teams and drive technical collaborations.

  • Excellent analytical and problem-solving skills.
  • Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.

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