Hardware Engineer

At NUVACORE we're designing a new general-purpose CPU core for the sustained, intensive demands of AI infrastructure and agentic computing, not the workloads of the past. We are seeking a highly skilled and motivated Hardware Board Design Engineer to drive the architecture, design, and development of next-generation, high-performance, and energy-efficient CPU server solutions for data center applications. In this role, you will be responsible for the end-to-end hardware development life cycle, from initial concept and feasibility studies to schematic capture, PCB layout oversight, component selection, and laboratory brings-up. You will collaborate closely with cross-functional teams—including Package Design, Signal/Power Integrity (SI/PI), Thermal/Mechanical Engineering, and Software/Firmware—to deliver robust, scalable, and cutting-edge system platform hardware.

ROLE

• Board-Level Architecture & Design: Lead the design and development of complex, multi-layer, high-density interconnect (HDI) server motherboards, baseboards, and riser cards optimized for data center workloads.
• Schematic Capture & Component Selection: Ownership of schematic entry, creation of complex hierarchical designs, and rigorous component selection prioritizing power efficiency, thermal performance, and long-term reliability.
• Layout Collaboration: Work hand-in-hand with PCB layout engineers to define board stack-ups, routing constraints, component placement, and shielding strategies.
• Cross-Functional Alignment: Collaborate tightly with the Silicon, Package Design, and SI/PI teams to implement optimal co-design methodologies for high-speed interfaces (e.g., PCIe Gen6/Gen7, DDR5/LPDDR6, CXL) and robust power delivery networks (PDN).
• Power & Thermal Management: Design highly efficient, high-current power delivery paths (VRMs, multiphase buck converters) capable of supporting ultra-high-power CPUs while meeting strict data center energy-efficiency metrics.
• Bring-up, Validation, & Debug: Lead the hands-on hardware bring-up, debugging, and validation of prototype boards in the lab using high-speed oscilloscopes, logic analyzers, and specialized test equipment.
• Manufacturing Support: Generate comprehensive fabrication and assembly documentation (Gerbers, BOMs, ODB++). Partner with fabrication houses and EMS partners to resolve DFM/DFA/DFT issues and ensure smooth mass production transitions.

REQUIREMENTS — MUST HAVE

• Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Experience: 5+ years of professional experience in high-speed hardware board design, ideally focused on enterprise servers, data center hardware, or complex computing platforms.
• EDA Tools: High proficiency in industry-standard schematic capture and PCB layout tools (e.g., Cadence Allegro, Concept HDL, OrCAD, or Altium Designer).
• High-Speed Design Knowledge: Direct experience designing with high-speed serial/parallel interfaces (such as PCIe, DDR/LPDDR, or USB) and understanding basic SI/PI constraints.
• Power Delivery: Proven experience with board-level power distribution design, DC-DC converters, and multi-phase VRMs supporting high-current rails.
• Lab Skills: Strong hands-on laboratory experience with hardware debugging, rework, and using diagnostic equipment (DMMs, scopes, network analyzers).

REQUIREMENTS — NICE TO HAVE

• Education: Master’s degree in Electrical Engineering or Computer Engineering.
• Advanced Data Center Experience: 10+ years deep understanding of data center server architectures, OCP (Open Compute Project) standards, and system topologies (e.g., CPU sockets, high-speed riser configurations, and BMC sub-systems).
• Silicon-Package-Board Co-Design: Familiarity with the interplay between advanced semiconductor packaging (e.g., chiplets, 2.5D bridges) and high-density PCB implementation.
• Simulation & Modeling: Familiarity with SI/PI and thermal simulation concepts using tools such as Ansys (SIwave, HFSS), Cadence Sigrity, or HyperLynx to guide early-stage design constraints.
• Manufacturing Integration: Strong background in optimizing layouts for high-volume manufacturing, minimizing layer counts while maintaining performance, and handling DFX (Design for Manufacturing/Assembly/Test) validation.
• Self-Driven & Collaborative: Excellent communication and cross-functional collaboration skills, with the ability to thrive in a fast-paced, startup-like environment.

The next great CPU won't build itself. We’re assembling a world-class team across every layer of CPU development, from architecture and design to verification, physical implementation, software, infrastructure, and product delivery. Every discipline matters, and every person has the opportunity to help shape the technology from the ground up.