3D IC and ADVANCED PACKAGING CAD ENGINEER
Markham, ONFull Time
AM
Advanced Micro Devices, Inc
Candidates need a bachelor's or master's degree in computer or electrical engineering, experience with 3D-IC design and advanced packaging, and hands-on work with Synopsys 3DIC Compiler. Strong scripting skills and experience applying AI to CAD or hardware design are also needed.
Synopsys 3DIC Compiler, Synopsys EDA tools, Cadence EDA tools, Linux/Unix, Python, TCL