Hardware Design Engineer – Application Engineering, Staff
Ottawa, ONQualcomm Canada ULC
4+ YOECandidates need a bachelor's degree in an engineering or computer science field with 4+ years of hardware engineering experience, or a master's with 3+ years, or a PhD with 2+ years. Strong high-speed PCB, SerDes and PAM4 knowledge, lab bring-up skills and signal and power integrity expertise are required.
HFSS, Laboratory test equipment, Schematic capture tools, PCB layout tools
Cross-Functional Engineer, Staff
Toronto, ON +1Qualcomm Canada ULC
4+ YOECandidates need a bachelor's, master's or PhD in Electrical Engineering with analog or mixed-signal chip design experience and several years of ASIC design or verification work. They also need strong high-speed SerDes knowledge, SystemVerilog and EDA tool skills.
Cadence, SPICE, MATLAB, Verilog, VHDL, SystemVerilog
FY27 Intern - Firmware/Embedded Software Engineering Internship - Canada (12 or 16 months)
Toronto, ONQualcomm Canada ULC
1+ YOECandidates need to be enrolled in a bachelor's degree in electrical or computer engineering, engineering science or computer science, with at least one year of academic programming experience in C, C++ or Python. Strong debugging, problem-solving and teamwork skills are needed, and availability must match the 12- or 16-month internship dates.
Git, Linux, FPGA, Verilog, SystemVerilog, GitHub Actions
FY27 Intern - Machine Learning Compiler & Performance Engineering Intern - Canada (16 months)
Markham, ONQualcomm Canada ULC
Candidates need proficiency in Python or C++, strong analytical and debugging skills, and good written and verbal communication. They must be pursuing a bachelor's degree in an engineering or computer science field, available May/June 2027 to August/September 2028, and expected to graduate November 2028 or later.
Git, Linux, SSH, CI/CD systems, PyTorch, ONNX