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AttoTude
Candidates need experience in advanced silicon packaging, multichip modules and high-speed interposer design, plus mechanical, thermal and FEA modeling. A proven product development track record from concept to volume production and a master's degree or higher in Mechanical Engineering, Materials Science or a related field are required.
Packaging processes, Packaging, Research, Problem solving, Assembly, FEA
Dennis Group
Candidates need a bachelor's degree in mechanical, packaging, industrial or manufacturing engineering, plus 0-3 years of experience or schooling in packaging equipment design. They need strong AutoCAD, MS Office and MS Project skills, and must be able to travel 50%+ of the year.
AutoCAD, MS Project, MS Office
Huawei Technologies Canada Co., Ltd.
5+ YOECandidates need five years of relevant industry experience and ideally a PhD in electrical engineering, RF/microwave or packaging. They need deep RF/microwave knowledge, EM and circuit simulation skills, and hands-on test vehicle and microelectronics assembly experience.
VNA, Probe station
onsemi: With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety,…
2+ YOECandidates need a Master's or PhD in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials, with 2-3+ years of relevant experience. They need knowledge of thermal and mechanical modeling, crystal plasticity, Cu/Ag sintering, semiconductor packaging, SolidWorks and FEA tools such as ANSYS.
ANSYS Mechanical APDL, SolidWorks, Unix/Linux
10 companies