Sr. Packaging NPI Engineer
Toronto, ONXanadu: is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers.
5+ YOECandidates need a master's degree in a technical field, 5+ years of packaging engineering experience focused on new product introduction, and proven work with packaging technologies. Knowledge of photonic on-chip and off-chip systems and CAD and statistical tools is also required.
SolidWorks, AutoCAD, FiconTEC equipment
Packaging Engineer - Optical Attach Process
Toronto, ONXanadu: is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers.
2+ YOECandidates need a master's degree in an engineering or materials field, proven experience with optical packaging equipment, and CAD and statistical analysis skills. Knowledge of photonic systems, electrical and pneumatic systems, and two or more years in packaging engineering are preferred.
ficonTEC equipment, SolidWorks, AutoCAD, Statistical analysis tools
Packaging Engineer - Die Bonding Process
Toronto, ONXanadu: is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers.
2+ YOECandidates need a BSc or higher in engineering or science and 2+ years in a lab or cleanroom. They need basic semiconductor packaging knowledge, epoxy and flip-chip die bonding experience, and microscopy skills.
Die bonding equipment, Microscope, Die shear test equipment