Sr. Manager Packaging Engineering
Markham, ONFull Time
AM
Advanced Micro Devices, Inc
Candidates need a bachelor's degree or higher in electrical, computer or mechanical engineering, plus proven leadership of complex concurrent projects. Experience in semiconductor package design, high-speed layout, OSAT and substrate work, and tools such as Synopsys 3DICC or Cadence SiP/APD is preferred.
Synopsys 3DICC, Cadence SiP, Cadence APD