3D IC and ADVANCED PACKAGING CAD ENGINEER
Markham, ONFull Time
AI
AMD, Inc.
Candidates need a computer or electrical engineering degree, experience in 3D-IC and advanced packaging, and hands-on work with Synopsys or Cadence EDA tools. Strong Python, TCL and Perl scripting on Linux, plus experience applying AI or LLMs to CAD or hardware design, are preferred.
Synopsys 3DIC Compiler, Synopsys EDA tools, Cadence EDA tools, Verilog, UPF, Python