Packaging Engineer - Die Bonding Process
Toronto, ONHybridFull Time
Xanadu: is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers.
2+ YOECandidates need a BSc or higher in engineering or science and 2+ years in a lab or cleanroom. They need basic semiconductor packaging knowledge, epoxy and flip-chip die bonding experience, and microscopy skills.
Die bonding equipment, Microscope, Die shear test equipment